MMIC Packaging Solutions Brochure

Teledyne Labtech, a business unit of Teledyne Microwave Solutions, has developed an innovative low cost custom packaging solution combining established microwave printed circuit board techniques with the use of low cost organic materials for single chip and MCM applications. They have also developed a cavity package that demonstrates excellent high frequency, thermal and electrical characteristics by raising the MMIC in a precisely machined, fully copper plated cavity. The resultant optimization of short bond wire lengths ensures minimal loss of chip performance. Download the brochure for more information.