MMIC Packaging

Source: Teledyne Microwave Solutions

MMIC Packaging

Teledyne Labtech has developed a custom packaging solution utilizing established microwave printed circuit board techniques and low-cost organic materials for single chip & MCM (Multichip Module) applications. Markets served include Defense, Aerospace, and Telecommunications.

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TMS MMIC Packaging At-A-Glance

  • Single chip & multi-chip module (MCM) solutions
  • LCP packages
  • Competitive pricing for high and low volume quantities
  • Excellent thermal performance >7w dissipation
  • Excellent RF performance at Ka band
  • Low cost tooling and short lead times for new designs
  • Perfect for auto assembly process
  • Available as SMD, BGA, drop in and flange configurations
  • Flexible footprint and cavity changes available

Key Features:

TMS has developed a cavity package that demonstrates excellent high frequency, thermal and electrical characteristics by raising the MMIC in a precisely machined, fully copper plated cavity. The resultant optimization of short bond wire lengths ensures minimal loss of chip performance. Applications and Markets include Defense, Aerospace, Telecommunications, LNAs, T/R modules, and PA modules. Our MMIC packaging is also suitable for high power GaN applications up to and including Ka-band.

Markets & Applications:

  • Multi-LCP packageDefense
  • Aerospace
  • Telecommunications
  • T/R modules
  • LNAs
  • PA modules

Download the brochure for more information.

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