Teledyne Labtech has developed a custom packaging solution utilizing established microwave printed circuit board techniques and low-cost organic materials for single chip & MCM (Multichip Module) applications. Markets served include Defense, Aerospace, and Telecommunications.
TMS MMIC Packaging At-A-Glance
TMS has developed a cavity package that demonstrates excellent high frequency, thermal and electrical characteristics by raising the MMIC in a precisely machined, fully copper plated cavity. The resultant optimization of short bond wire lengths ensures minimal loss of chip performance. Applications and Markets include Defense, Aerospace, Telecommunications, LNAs, T/R modules, and PA modules. Our MMIC packaging is also suitable for high power GaN applications up to and including Ka-band.
Markets & Applications:
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