News | November 11, 2016

Meeting Electromagnetic Engineering Technology (MEET) 2016: A Successful First Edition

Source: IDS Ingegneria Dei Sistemi S.p.A.
Meeting Electromagnetic Engineering Technology (MEET) 2016: A Successful First Edition

Great success for MEET 2016! The conference, in its first edition, has brought together over a hundred experts within the scientific field of electromagnetic engineering technology. Engineers, companies' managers, high ranks of the Italian defense community, professors, scientists from Italy, Belgium, China, Denmark, India, Japan, Russia, South Korea, South Africa, Sweden, U.K., U.S.A. have shared their knowledge and discussed the state-of-the-art and future development of EME technology. The first day was held at the prestigious Institute of Military Aeronautical Sciences (ISMA – Istituto di Scienze Militari Aeronautiche) location in Florence, and then at the IDS headquarters in Pisa.

“Real-life innovations” are leveraging new products and services. Most of these are based on completely new technology applications: wireless communication, sensor based applications and the Internet of Things, autonomous cars/vehicles/drones, fast automation applications. In recent years, technological progress in electromagnetic science through enhancements in software and numerical techniques, in the integration of “physical testing/measuring” with simulation/virtual testing, and more has allowed significant advancement to be made in the field of Electro-Magnetic Engineering (EME) and has expanded the range of applications. This progress includes improvements in the basic modelling algorithms through the use of acceleration methods, optimized simulation tools using surface response algorithms and the increasing use of High Performance Computing (HPC). New synergies have also been created between modelling and measurement techniques, significantly improving the accuracy, effectiveness and interoperability of both. The time to market and development costs of products have been reduced through the inclusion of fast-prototyping tools in the design process. In addition, procedures for meta-material based devices, from design to manufacturing, testing and qualification, have been developed to complete the loop in creating innovative solutions.

In this context, MEET 2016 has achieved its goal to facilitate collaboration among industry and academic experts allowing them to share the latest cutting edge aspects of EME technology through the use of real-case applications from around the world and to introduce various virtual and physical testing systems. A sincere thank you to all the speakers, the participants and to the MEET 2016 patrons and sponsors: ENAC, AID, Brigata RISTA-EW, ENAV, AIAD, AIDAA, NAFEMS, MIMOS (patrons); Eurotech, EMA, TT Tecnosistemi, Nice, Pasquali Microwave Systems, Microlease (sponsors).

SOURCE: IDS Ingegneria Dei Sistemi S.p.A.