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Laminate For RF And Microwave Printed Circuit Boards: AD250C

Source: Arlon Materials for Electronics

Laminate For RF And Microwave Printed Circuit Boards: AD250C
Arlon's AD250C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD250C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today's telecommunication infrastructure.

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Datasheet: Laminate For RF And Microwave Printed Circuit Boards: AD250C

PTFE/Woven Fiberglass/Micro-Dispersed Ceramic Filled Laminate for RF & Microwave Printed Circuit Boards

AD250C combines the superior thermal properties of a fluoropolymer resin system with selected ceramic materials and fiberglass reinforcement to yield a laminate material with lower loss (Df=0.0014 at 10GHz), lower thermal expansion properties and lower passive intermodulation (PIM). AD250C also represents further improvements over Arlon's AD250A product in terms of cost.

Stability of PTFE over wide frequency and temperature ranges with low loss properties, makes AD250C ideal for a variety of microwave and RF applications in telecom infrastructure. The inclusion of micro-dispersed ceramic provides thermal stability to the laminate in the form of lower CTE values and greater phase stability across temperatures.

The net combination of properties of AD250C are highly desired in applications where higher frequency and expectations for longevity in material performance for high gain and broadband signals, which are typically beyond the performance capabilities offered by low loss thermosets.

AD250Cis compatible with the processing used for standard PTFE based printed circuit board substrates. Its low Z-axis thermal expansion improves plated through-hole (PTH) reliability compared to typical PTFE based laminates. Low X-Y expansion improves BGA solder-joint reliability.

Features:

  • Very Low Loss PTFE and Ceramic Filled Composite (0.0014 Loss Tangent at 10GHz and Base Station Frequencies)
  • Dielectric Constant (2.50) with Tight Tolerance
  • Low Dielectric Loss (Loss Tangent)
  • Low Profile Copper (lower conductive losses and lowest PIM)
  • Low Z-Direction CTE
  • Large Panel Sizes Available

Benefits:

  • Higher Antenna Efficiencies
  • Lower Insertion Loss
  • Low PIM for Antenna Applications
  • Improved TCEr for Phase Stability
  • Ceramic Provides Higher Degree of Dielectric Constant Stability as Temperatures Change or Cycle

Typical Applications:

  • Base Station Antenna Applications
  • Commercial Antennas
  • Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
  • Radar Manifolds and Feed Networks

Click Here To Download:
Datasheet: Laminate For RF And Microwave Printed Circuit Boards: AD250C