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High Power PIN Diodes: BRO399-11A

Source: Skyworks Solutions, Inc.

High Power PIN Diodes: BRO399-11A

Skyworks’ SMP1324-087LF, SMP1371-087LF and SMP1302-085LF PIN diodes are designed for use in high-power-handling switches from 1–900 MHz. SMP1324-087LF and SMP1371-087LF are optimized for use as series diodes. SMP1302-085LF is optimized for use as a shunt diode. Due to their thermally-enhanced package designs, these diodes have very low thermal resistance which enables them to handle very large input power.

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Datasheet: High Power PIN Diodes: BRO399-11A

The SMP1345-087LF is ideally suited for use as a high isolation, series switching element. The SMP1345-087LF has a 10 micron nominal I layer thickness, which enables it to switch impedance very rapidly while handling large input signals, when the exposed paddle of the diode is connected to a printed circuit board which provides an adequately large thermal conductance to a heatsink to maintain the die temperature to be less than 150 °C. Minority carrier lifetime is 100 ns typical, series resistance at 10 mA bias current is 1.5 Ω typical and total capacitance is less than 0.2 pF maximum.

The SMP1371-087LF has a 12 micron nominal I layer thickness, which enables it to handle input signals up to 23 W CW when the device is mounted as a series element in a switch built on a printed circuit board which has a relatively high thermal conductance, such as Rogers 5880. In the identical circuit constructed on FR4 printed circuit board material the maximum input power is 20 W CW. Minority carrier lifetime is 200 ns minimum, series resistance at 10 mA bias current is 0.5 Ω maximum and total capacitance is 0.9 pF typical. The SMP1371-087LF is rated to dissipate 2 W maximum.

The SMP1324-087LF has a 100 micron nominal I layer thickness, which enables it to handle input signals up to 35 W CW when the device is mounted as a series element in a switch built on a printed circuit board which has a relatively high thermal conductance, such as Rogers 5880. In the identical circuit constructed on FR4 printed circuit board material the maximum input power is 30 W CW. Minority carrier lifetime is 6 µs typical, series resistance at 50 mA bias current is 0.4 Ω typical and total capacitance is 0.9 pF typical. The SMP1324-087LF is rated to dissipate 2 W maximum.

The SMP1302-085LF is ideally suited for use as a shunt switching element. The SMP1302-085LF has a 50 micron nominal I layer thickness, which enables it to handle input signals as large as 50 W CW when the exposed paddle of the diode is connected to a printed circuit board which provides an adequately large thermal conductance to a heat sink to maintain the die temperature to be less than 150 °C. Minority carrier lifetime is 700 ns typical, series resistance at 100 mA bias current is 1 Ω typical and total capacitance is less than 0.3 pF.

Package Characteristics
The 087LF package is a 2 x 2 x 0.9 mm surface mount QFN package with an exposed paddle. The die is mounted directly onto this solid metal paddle, which provides a very low thermal resistance path from the die to the environment external to the die. This low thermal resistance permits the die to maintain low junction temperature when dissipating significant power, thereby enabling the die to handle high power input signals.

The 085LF package is a 2 x 2 x 0.9 mm, surface mount plastic package. This package has three terminals, one of which is an exposed paddle which is the cathode contact, the remaining two of which are each connected to the anode of the diode. The exposed paddle provides a very low thermal resistance path from the cathode of the diode to the environment external to the die. The two anode contacts are situated on opposite sides of the exposed paddle, which is optimal for connecting two transmission line sections together via a shunt PIN diode.

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Datasheet: High Power PIN Diodes: BRO399-11A

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