High Frequency Single And Multi-Chip Modules Based On LCP Substrates

By Labtech Microwave

Overview

Labtech Microwave has produced modules for MMIC's (microwave monolithic integrated circuits) based on LCP (liquid crystal polymer) substrates for many applications ranging from Ka band to >90GHz. A wide range of structures are available to cater for a broad range of frequencies and thermal requirements. Near hermetic performance can be obtained from correctly configured LCP modules.

Single chip modules

Single chip modules can be realised using laser based processing technology to ensure very consistent definition of mechanical features. Via holes forming the transition from upper conductors to lower conductors are laser drilled (blind) and copper plated. The upper conductors are copper (nominally 40um thick) and the lower conductors are a sandwich of copper-nickel-copper (nominally 35um, 20um, 35um respectively). The nickel provides rigidity to the module to prevent damage to the MMIC's during handling and SMT assembly.