The new ComClad material technology is designed for the microwave and RF segments of the wireless market. It is available in prototype and production quantities, and can be provided in industry standard panel sizes with a variety of copper foils and dielectric thicknesses. The new technology is compatible with standard panel circuit board processing equipment; no retooling required. It is currently being produced.
<%=company%>, 1150 Sheldahl Road, Northfield, MN 55057. Phone: 507-663-8477, Fax: 507-663-8545.