MegaPhase offers the High-Density Interconnect (HDi) product line with a variety of connector configurations to system designers to optimize packaging miniaturization while maintaining electrical and mechanical robustness. These solutions are based on snap-in interfaces, SMP, SMPM and SMPS per MIL-STD-348B, and are ideal for applications requiring lighter weight, high densities, and higher performance.
Additional High Density Interconnects (HDi) features include:
Solutions include PCB mounting types: surface mount, through mount, surface mount right angle, and edge mount
Interfaces offered: 1.0mm, 2.4mm, 2.92mm, SSMA, SMP, SMPM, SMPS and more
Coaxial-to-PCB transition simulation service provided at NO COST.