Application Note: Guidelines For Installing Hermetic GPO And GPPO Connectors
Source: Corning Gilbert Inc.
Microelectronic packaging applications often require the
package to be hermetically sealed to protect the delicate and
sensitive components installed within. Many applications also
require that the packages be light and compact.
PDF Format.
access the Application Note!
Log In
Get unlimited access to:
Trend and Thought Leadership Articles
Case Studies & White Papers
Extensive Product Database
Members-Only Premium Content
Welcome Back! Please Log In to Continue.
X
Enter your credentials below to log in. Not yet a member of RF Globalnet? Subscribe today.
Subscribe to RF Globalnet
X
Subscribe to RF Globalnet
This website uses cookies to ensure you get the best experience on our website. Learn more