Datasheet | May 11, 2007

Datasheet: G3PO™ High Density Micro-Block™

Source: Corning Gilbert Inc.
Corning Gilbert G3PO High Density Micro-Block offers unparalleled electromechanical performance and flexibility for today's requirements. The Micro-Block system utilizes Corning Gilbert's G3PO interface to provide high density, high performance, push-on microwave interconnect in an all inclusive package. It is ideal when developing a new back plane or a high performance I/O system utilizing differential and/or RF signals.
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