Product/Service

G3PO™ High Density Micro-Block™

Source: Corning Gilbert Inc.
Corning Gilbert G3PO High Density Micro-Block offers unparalleled electromechanical performance and flexibility for today's requirements. The Micro-Block system utilizes Corning Gilbert's G3PO interface to provide high density, high performance, push-on microwave interconnect in an all inclusive package. It is ideal when developing a new back plane or a high performance I/O system utilizing differential and/or RF signals

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•Datasheet: G3PO™ High Density Micro-Block™

Corning Gilbert G3PO High Density Micro-Block offers unparalleled electromechanical performance and flexibility for today's requirements. The Micro-Block system utilizes Corning Gilbert's G3PO interface to provide high density, high performance, push-on microwave interconnect in an all inclusive package. It is ideal when developing a new back plane or a high performance I/O system utilizing differential and/or RF signals. The G3PO High Density Micro-Block features minimum pitch of 0.085" board to board and 0.115" cable to board, and provides RF performance from DC to 65 GHz.

Corning Gilbert has 50 years of experience in designing and manufacturing high performance connectors for microwave systems and broadband telecommunications. As the pioneer of the GPO®, GPPO® and G3PO™ connectors, it leads the industry gold standard for coaxial push-on interconnect solutions. Today, Corning Gilbert push-on connectors are increasingly seen as the high frequency interconnect solution of choice for military, satellite, wireless and telecommunications applications.

Click Here To Download:
•Datasheet: G3PO™ High Density Micro-Block™