Product/Service

Circuit Board And Packaging Solutions

Source: Teledyne Microwave Solutions

MMIC Packaging

Teledyne Microwave Solutions is one of the world's leading manufacturers of microwave circuit solutions with specialist capabilities in design, manufacturing, assembly, and testing across many technologies and products.

Request Information

Microwave PCBs

TMS offers design support, manufacture, assembly, and test of an extensive range of Microwave PCBs.

Teledyne Labtech, a business unit of Teledyne Microwave Solutions, is one of the world’s leading manufacturers of complex and high technology demanding microwave printed circuit boards with an established pedigree spanning more than 30 years. Providing specialized solutions for a range of markets including Defense, Aerospace, High-end Telecom, Satcom and Test Instrumentation, TMS offers a wide range of complementary microwave PCB capabilities.

MMIC Packaging

Teledyne Labtech has developed a custom packaging solution utilizing established microwave printed circuit board techniques and low-cost organic materials for single chip & MCM (Multichip Module) applications. Markets served include Defense, Aerospace, and Telecommunications.

TMS MMIC Packaging At-A-Glance

  • Single chip & multi-chip module (MCM) solutions
  • LCP packages
  • Competitive pricing for high and low volume quantities
  • Excellent thermal performance >7w dissipation
  • Excellent RF performance at Ka band
  • Low cost tooling and short lead times for new designs
  • Perfect for auto assembly process
  • Available as SMD, BGA, drop in and flange configurations
  • Flexible footprint and cavity changes available

Key Features:

TMS has developed a cavity package that demonstrates excellent high frequency, thermal and electrical characteristics by raising the MMIC in a precisely machined, fully copper plated cavity. The resultant optimization of short bond wire lengths ensures minimal loss of chip performance. Applications and Markets include Defense, Aerospace, Telecommunications, LNAs, T/R modules, and PA modules. Our MMIC packaging is also suitable for high power GaN applications up to and including Ka-band.

Markets & Applications:

  • Multi-LCP packageDefense
  • Aerospace
  • Telecommunications
  • T/R modules
  • LNAs
  • PA modules

Download the brochure for more information.

Need More Information? Just Ask.

Click the button below to directly contact the supplier. Use it to:

  • Ask a question.
  • Request more detailed information or literature.
  • Discuss your current project/application.
  • Request a quote.
  • Locate a distributor in your area.
  • Schedule a demo.
Request Information