Newsletter | August 28, 2019

08.28.19 -- August's Most Popular Articles & News

 
Most Popular Editorial
Packaging For Millimeter-Wave Devices — Why Do We Need It, And How Do We Do It?
 
By Liam Devlin, CEO, Plextek RFI

Several package types can be used at millimeter-wave frequencies, so the choice will depend on the specific application. However, some general design rules apply to all forms of packaging.

Most Popular Articles
Designing Microwave PCBs For Successful Manufacture — Getting It Right The First Time
By Teledyne Defense Electronics, LLC

With improvements in processor speed and model accuracy, it is more common for microwave circuit simulations to bear close approximation to their eventual real-world performance. However, not all pitfalls present in the successful manufacture of a complex microwave circuit are captured in simulations. 

RF Board Connector: Footprint Optimization
By HUBER+SUHNER

While low frequency/low data rate applications can use a generic footprint for RF board connectors, modern bandwidths that support data rate of 56 Gbps and beyond require an optimized footprint designed and matched to a specific board stackup.

Glass Sidewall Packages Provide Performance For RF Applications
By Minh Tran, Mini-Systems, Inc.

Glass sidewall packages achieve highest levels of hermeticity for hardware in space vacuums and extreme temperatures. Compared to ceramic, they deliver better RF performance thanks to their lower dielectric constant.

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