With improvements in processor speed and model accuracy, it is more common for microwave circuit simulations to bear close approximation to their eventual real-world performance. However, not all pitfalls present in the successful manufacture of a complex microwave circuit are captured in simulations.
While low frequency/low data rate applications can use a generic footprint for RF board connectors, modern bandwidths that support data rate of 56 Gbps and beyond require an optimized footprint designed and matched to a specific board stackup.
Glass sidewall packages achieve highest levels of hermeticity for hardware in space vacuums and extreme temperatures. Compared to ceramic, they deliver better RF performance thanks to their lower dielectric constant.
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