Datasheet | October 5, 2017

Assembly Technology Overview

Source: Micro Systems Technologies

The MST Group is a leading specialist in the development and manufacture of electronic modules for active implants but also for other applications requiring exceptional performance and the highest level of reliability. In addition to interconnect and semiconductor packaging technologies, the group covers all major board assembly technologies. SMT (Surface Mount Technology) and chip & wire technologies are available for the assembly of components like SMDs, BGAs, LGAs, CSPs, flip chips or bare dies on ceramic and organic substrates. For more information download the overview datasheet:

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Micro Systems Technologies