HTC uses its patented STT™ reaction process system to manufacture a patented microcomposite that is the fundamental building block of electronic substrates and HTC millimeterwave electronic packages. HTC's proprietary and patented processes tailor dielectric, thermal, and thermal expansion properties of micro-composite materials with tight statistical repeatability and provide low cost optimization of RF/microwave components and circuits.

Typical applications are microwave and millimeterwave radio functional building blocks like amplifiers, filters, and high-speed optical packaging. Depending on the frequency of the application and its end-use, HTC microelectronic substrates and packaging can provide significant cost savings and premium performance over conventional ceramic and soft board materials.

Typical applications include: