Products and Services
PCBA-Equipment Listing
Source:
Abante Services
Abante offers a full spectrum of PCBA services, including related turnkey offerings.
PCBA-Equipment Listing
A world-class PCBA assembler can be judged in-part by the equipment and
technology it can wield for its customers. In planning our equipment
purchases, we had several intended objectives:
- A high degree of automation, precision, repeatability, and throughput speed
- Increased capacity- overall, and in our ability to perform more concurrent projects
- Flexibility in many forms
- Modularization- ability of equipment/lines to perform completely and independently or be combined with others as needs dictate
- Quick changeover times for individual equipment
- Ease of reconfiguration of lines
The following is a partial listing of equipment, the highlights of what we
use everyday to serve our customers better.
|
Process
|
Function
|
Equipment
|
Quantity
|
|
SMT Assembly |
Automated Screen Printing |
Icon
Technologies i8
|
3
|
|
Fuji GSPIII
|
1
|
||
|
Automated Glue Dispensing
|
Fuji GL II
|
4
|
|
|
Automated Pick-and-Place:
Chip Shooter (speed placement)
|
Fuji
NXT
|
1
|
|
|
Mirae MX-310T
|
1
|
||
|
Mirae MPS1010
|
1
|
||
|
Fuji CP IV-2
|
1
|
||
|
Fuji CP IV-3
|
1
|
||
|
Automated Pick-and-Place:
Multi-Purpose (placement of fine-pitch and odd-form
components)
|
Fuji
XP 243E
|
1
|
|
|
Mirae MX-310QP
|
1
|
||
|
Mirae MPS1020 QP
|
1
|
||
|
Fuji IP-II
|
1
|
||
|
Reflow Oven- forced air, convection
|
Vitronics
MR 933
|
1
|
|
|
TMPL 1700S
|
1
|
||
|
BTU TRS182
|
1
|
||
|
SMT 460 C
|
1
|
||
|
Through-Hole Assembly
|
Automated Wave Soldering
|
Electrovert Europack
|
1
|
|
Hollis GBS MKIII |
1 |
||
|
TMPL SMT 300 |
1 |
||
|
Inspection
|
In-line, Automated Optical Inspection (AOI)
|
ViTechnology Vi-3KA |
1
|
|
Orbotech VT 9300 |
1
|
In-line, Automated X-ray Inspection (AXI)
|
Glenbrook
Technologies RTX-113HB
|
1
|
| Video Microscope- 40x to 100x magnification |
Sony Technolook TWU-TL1Z |
1 |
|
|
Testing
|
In-Circuit Testing (ICT),
bed-of-nails
|
Genrad 2272
|
1
|
|
In-Circuit Testing (ICT), flying
probe (FPT)
|
Hioki
1240-02
|
1
|
|
|
Burn-in Testing
|
Harris
UDS3000
|
1
|
|
|
Environmental Testing
|
SLD/OKKO
810A
|
1
|
|
|
Assembly, rework and repair
|
BGA repair
|
PDR X410 Air-vac BGA rework systems |
1
|
|
BGA reballing
|
Martin Hot-Reball-03
|
1
|
|
|
Assembly, miscellaneous
|
Conformal coating
|
TMPL Curomatic
|
1
|
|
Press-fitting
|
3-ton hyropneumatic press
|
1
|
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