Products and Services
ECCOSTOCK® FPH - High Temperature Foam-In-Place Liquid
Source:
Emerson & Cuming Microwave Products
Rigid, high temperature polyurethane (isocyanate)
two part closed cell foam-in-place resin system. Once cured, ECCOSTOCK® FPH will withstand
continuous exposure up to 275°F (135°C) and up to
325°F (163°C) for short periods remaining rigid.
Click Here To Download:
•Datasheet: ECCOSTOCK® FPH - High Temperature Foam-In-Place Liquid
Material Characteristics
•Datasheet: ECCOSTOCK® FPH - High Temperature Foam-In-Place Liquid
•Datasheet: ECCOSTOCK® FPH - High Temperature Foam-In-Place Liquid
Material Characteristics
- Rigid, high temperature polyurethane (isocyanate) two part closed cell foam-in-place resin system
- Once cured, ECCOSTOCK® FPH will withstand continuous exposure up to 275°F (135°C) and up to 325°F (163°C) for short periods remaining rigid
- Typical thermal conductivities of ECCOSTOCK® FPH are seen around 0.14 (BTU)(in)/(ft2)(hr)(°F), 0.03 Watts/(meter)(°C)
- Cured ECCOSTOCK® FPH does not support fungal growth per MIL-STD-810E
Applications
- Encapsulation of electronic modules, antennas, rockets, satellites and missiles
- Encapsulation of coiled waveguide delay line to provide rigidity
- Vibration and sound deadener when applied to interior surfaces of an instrument cabin
- Encapsulation of crystal ovens for temperature stability
- Shaking material for high Q coils
Click Here To Download:
•Datasheet: ECCOSTOCK® FPH - High Temperature Foam-In-Place Liquid
