Products and Services
ECCOSTOCK® FFP - One Part, Free Flowing, Syntactic Foam Powder
Source:
Emerson & Cuming Microwave Products
ECCOSTOCK® FFP is designed to infiltrate densely populated electronic packages, readily filling available volumes around components. It been used to stabilize crystal oscillators as well as other delicate components that need to be held in place or thermally protected
Click Here To Download:
•Datasheet: ECCOSTOCK® FFP - One Part, Free Flowing, Syntactic Foam Powder
•Datasheet: ECCOSTOCK® FFP - One Part, Free Flowing, Syntactic Foam Powder
•Datasheet: ECCOSTOCK® FFP - One Part, Free Flowing, Syntactic Foam Powder
New and improved product with lower shrinkage and improved thermal stability.
Material Characteristics- Low cost, low loss, and low dielectric constant
- This one-part, epoxy-based, free-flowing powder cures at elevated temperatures to a rigid, non-burning syntactic foam
- ECCOSTOCK® FFP is extremely light weight and provides physical support as well as thermal insulation without increasing the weight or dielectric constant
- ECCOSTOCK® FFP exhibits minimum shrinkage during cure, exerting minimum stress on delicate components
- Cured material can be easily removed with tools enabling access to repair or replace components
- Since cured ECCOSTOCK® FFP is porous, an application of an epoxy coating will reduce moisture absorption
- Shelf life is 6 months if stored in a cool dry place out of direct sunlight at 21 °C (70 °F)
Applications
- ECCOSTOCK® FFP is designed to infiltrate densely populated electronic packages, readily filling available volumes around components. It been used to stabilize crystal oscillators as well as other delicate components that need to be held in place or thermally protected.
- ECCOSTOCK® FFP has also found its way into machinery operating in high vibration environments to keep electrical components from shaking apart
Click Here To Download:
•Datasheet: ECCOSTOCK® FFP - One Part, Free Flowing, Syntactic Foam Powder
