Current Headlines

  1. RedEye 3D Prints Functional Antenna Arrays For NASA COSMIC-2 Satellites
    11/20/2014

    RedEye, a Stratasys Company and leading provider of 3D printing and additive manufacturing services, has partnered with NASA’s Jet Propulsion Laboratory (JPL) to 3D print 30 antenna array supports for the FORMOSAT-7 Constellation Observing System for Meteorology, Ionosphere, and Climate (COSMIC-2) satellite mission.

  2. BAE Systems To Create Progressive Communication Framework In Response To Adversarial Threats
    11/20/2014

    The U.S. Defense Advanced Research Projects Agency (DARPA) has awarded BAE Systems a contract to combat the rapid evolution of technological threats posed by U.S. adversaries.

  3. Researchers Advance 'Quantum Teleportation'
    11/20/2014

    The world at the quantum level, at the scale of particles too small for the eye to see, is very strange. It's possible, for instance, to have two particles that are "entangled" -- that is, they function as if they were connected, even if they are many miles away from each other.

  4. Anritsu Demonstrates World’s First LTE Advanced Category 9 With 3x CA
    11/20/2014

    Anritsu Company announces it has successfully demonstrated stable peak data throughput for a Category 9 LTE device and network simulator using 3x Carrier Aggregation (3x CA).

  5. Tomorrow’s Degradable Electronics
    11/20/2014

    When the FM frequencies are removed in Norway in 2017, all old-fashioned radios will become obsolete, leaving the biggest collection of redundant electronics ever seen – a mountain of waste weighing something between 25,000 and 30,000 tonnes.

  6. Saab Signs Teaming Agreement With Indonesian PT Pindad For GBAD systems
    11/20/2014

    The teaming agreement is a long term agreement with the goal to win air defence business in Indonesia.

  7. Global 3D ICs Market To Grow At 18.1% CAGR From 2013 To 2019
    11/19/2014

    A new market study published by Transparency market Research (TMR), a US based market intelligence firm, forecasts that the global 3D ICs marketwill grow at a healthy CAGR of 18.1% between the years 2013 and 2019. Growing at this pace, this market that valued US$2.4B in 2012 is expected to cross US$7.52B by 2019.

  8. NRL And Collaborators Conduct 100 Gigabit/Second Remote I/O Demonstration
    11/19/2014

    The Naval Research Laboratory (NRL), in collaboration with the DOE's Energy Sciences Network (ESnet), the International Center for Advanced Internet Research (iCAIR) at Northwestern University, the Center for Data Intensive Science (CDIS) at the University of Chicago, the Open Cloud Consortium (OCC) and significant industry support, have conducted a 100 gigabits per second (100G) remote I/O demonstration at the SC14 supercomputing conference in New Orleans, LA.

  9. Richardson RFPD Introduces New Four-Stage E-Band Driver Amplifier From MACOM
    11/19/2014

    Richardson RFPD, Inc. announced recently the availability and full design support capabilities for a new four-stage E-band driver amplifier from M/A-COM Technology Solutions.

  10. TE Connectivity Opens Wearables Lab To Address Rapid Growth In Market
    11/19/2014

    TE Connectivity Ltd. (NYSE: TEL), a world leader in connectivity, today announced the official opening of its TE Wearables Lab in Menlo Park, California.

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