Integra Technologies, Inc. is an ISO 9001:2000 certified manufacturer of state of the art RF power transistors, pallets and RF high power amplifiers (HPA). The facility produces 150mm (6”) wafers in its 300 square meter Class-100 clean room. In addition, device assembly and 100% functional testing is performed onsite using fully automated equipment.
Integra's patent protected technology consists of BIPOLAR and MOSFET transistors. Integra manufactures all gold metal bipolar RF power transistors, VDMOS and LDMOS FET RF power transistors, RF high power amplifiers and hybrid assemblies intended for Avionics, Radar, communication and other defense applications.
Integra is fully committed to a policy of total customer satisfaction through compliance to our customers’ requirements, on-time delivery, and continual improvement of our quality systems.
Integra excels by providing the highest power, gain and efficiency devices available. Extensive technical support and application specific designs make Integra the preferred choice for your system.
About Us:
John Titizian and Jeff Burger founded Integra Technologies in February 1997 with the goal of redefining the state of the art in S-band power transistors. With the help of Young Kim, PhD. and Apet Barsegyan this goal was realized, culminating in the granting of two US patents in late 2001. This core group of engineers and scientists has worked in the high power RF semiconductor industry since the 1970s, beginning at Power Hybrids, Inc. (PHI)
At its inception, Integra operated using a fabless model, producing die in both Silicon Valley and Asia. After several years it became apparent that the wafer fabrication process would need to be performed onsite to ensure consistent high quality devices. It was at this point that Integra built the largest and most modern all gold metal wafer fab in the world. They now have the capacity to fabricate 250 6” (150mm) wafers/month, enough to assemble more than 20,000 devices/month.
Integra Technologies has continued to expand in size and capability and has recently added an additional building adjacent to the primary facility, increasing overall square footage by 50%. This additional space will allow for new automated die attach, wire bonding, and RF test equipment and will enable significant increases in production efficiency and throughput.
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