Brochure | January 24, 2013
UltraSource Technology Platform Brochure
Source: UltraSource, Inc.The constant press for competitive products in the commercial wireless, fiber optic telecommunications, and military RF/microwave markets means designers must strive for means of reaching new levels of performance, miniaturization, and lower total system costs. To meet the challenges and requirements for low power consumption and bandwidth efficiency, thin film technology can be used as a powerful packaging solution due to its accuracy, reproducibility, and superior material properties.