UltraSource Mulilayer Brochure

The constant evolution of RF/microwave communications systems requires designers to strive for means of reaching new levels of electrical performance, miniaturization, and lower total system costs. A production proven thin film multilayer technology platform, which was originally developed for the interconnection of high speed digital circuits, has been developed by UltraSource® for use in the construction of multilevel DC, RF, and microwave circuits containing integrated passive components. The high accuracy and repeatability of this platform allows the technology to be a viable choice for packaging high frequency miniaturized electronics.