Texas Instruments And 4DSP Collaborate On FPGA Mezzanine Card, Enabling Mission Critical Developers To Meet Vital COTS-Based System Requirements
Texas Instruments Incorporated (TI) and 4DSP, an innovative company specializing in low power, low weight and compact FPGA-based signal and image processing systems, today announced their collaboration on a new mezzanine card, the FMC667, for mission critical applications. 4DSP’s FMC667 mezzanine card, based on the emerging FMC form factor, includes TI’s KeyStone-based TMS320C6678 multicore digital signal processor (DSP), DRAM memory and peripherals. With TI’s high-performance C6678 multicore DSP, the FMC667 is able to more effectively and rapidly meet the essential requirements of Commercial Off-The-Shelf (COTS)-based systems, as well as increase processing power, accuracy and finer resolution in mission critical and industrial applications.
“TI’s multicore software development kit made it easy for us to develop support libraries for our FMC667 card” said Arnaud Maye, Embedded Software Manager at 4DSP. “With eight 1.25 GHz cores in parallel and the built-in capability to be a PCIe root complex, TI’s C6678 DSP affirms itself as a control and high-end processing node for the most demanding applications.”
4DSP’s FMC667 card is primarily intended to be used in applications where an FPGA and DSP act as a co-processor of one another, such as video, telecom infrastructure, imaging, medical and wireless infrastructure markets. Mechanically and electrically compliant to the FMC standard (ANSI/VITA 57.1), the FMC667 module has a high-pin count connector and can be used in a conduction-cooled environment. Additionally, the card is also equipped with power supply and temperature monitoring, offering several power-down modes to switch off unused functions and peripheral interfaces.
Functionality, reliability and precision are vital factors mission critical developers must take into consideration when designing quality system applications. TI’s C6678 multicore DSPs deliver the industry’s first 10 GHz DSP with fixed- and floating-point performance on a single device for increased precision, a key requirement for mission critical systems. Additionally, the C6678 multicore DSPs increase system capabilities by consolidating the functionality of multiple DSPs onto a single device, saving board space and cost and alleviating the challenge of size, weight and power (SwaP), as well as reducing overall clock rates and power consumptions.
The FMC667 mezzanine card will be available on March 15. For more information, please visit www.4dsp.com.
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About TI’s KeyStone Multicore Architecture
TI’s KeyStone multicore architecture is the platform for true multicore innovation, offering developers a robust portfolio of high performance, low-power multicore devices. Unleashing breakthrough performance, the KeyStone architecture is the foundation upon which TI’s new TMS320C66x DSP generation was developed. KeyStone differs from any other multicore architecture as it has the capacity to provide full processing capability to every core in a multicore device. KeyStone-based devices are optimized for high performance markets including wireless base stations, mission critical, test and automation, medical imaging and high performance computing. Learn more at www.ti.com/multicore.
About 4DSP LLC
4DSP is an innovative company specializing in low power, low weight and compact FPGA based signal and image processing systems. Headquartered in Austin, Texas, USA, with offices in the Netherlands, 4DSP is a developer of reconfigurable computers of advanced architecture which offer customers maximum flexibility and scalability. 4DSP's hardware platforms deliver unmatched performance for advanced digital signal processing (DSP) applications in embedded computing applications. For more information, visit http://www.4dsp.com.
About Texas Instruments
Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. For more information, visit www.ti.com.
SOURCE: Texas Instruments Incorporated