News | December 20, 2013

LPKF Announces New UV Laser Depaneling Systems For 2014

LPKF Laser & Electronics has announced a new line of UV laser cutting systems for printed circuit board depaneling. Available in early 2014, the MicroLine 2000 Series features a range of systems that meet the rigorous standards of modern circuit depaneling.

The MicroLine 2000 Series benefits from a low-stress UV laser source, which provides two main advantages: the elimination of mechanical stress and the ability to process a wide variety of circuit materials, including flexible, rigid, and rigid-flex substrates.

MicroLine 2000 Series systems will be available in either stand-alone or inline configuration. In addition, systems can be equipped with either a 6 or 12 watt laser source to match user application requirements.

For more information on the MicroLine2000 Series, visit LPKF’s website:  http://www.lpkfusa.com/microline/2000S.htm.

About LPKF
Established in 1976, LPKF Laser & Electronics manufactures milling machines and laser systems used in circuit board and microelectronics fabrication, medical technology, the automotive sector, and the production of solar cells. LPKF’s worldwide headquarters is located in Hannover, Germany and its North American headquarters resides nearPortland, Ore.

SOURCE: LPKF Laser & Electronics

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