Improve Thermal and Electrical Conductivity with Pure Copper

CopperVia^TM is a process used to fill vias with pure copper material in ceramic thin film substrates. This is done to provide a low cost and highly conductive electrical thermal path in the substrates. This process eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.

CopperVia^TM results in a 30% gain in thermal and electrical conductivity improvement by using pure copper over pure gold. This creates an efficient cooling path when high power devices are mounted on top of a thin film component. This technology is particularly useful for designers of thin film circuits and interconnects, and provides those same designers with a cost effective technology that enables high performance in DC, RF/Microwave, and optical structures. Download the datasheet for additional information.