Datasheet | January 17, 2013

CopperVia™

Source: UltraSource, Inc.

CopperVia^TM is a process used to fill vias with pure copper material in ceramic thin film substrates. To find out how CopperVia^TMcan improve performance in DC, RF/Microwave, and optical structures in thin film circuits and interconnects, download the datasheet.

Uploaded: January 2013

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Datasheet | January 17, 2013

CopperVia™

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