Copper filled vias offer several advantages over gold filled vias in relation to thermal and electrical conductivity. This makes them ideal for microelectronics providers, hybrid manufacturers, and in commercial packaging applications. As the price of gold has risen steadily over the last decade, copper also provides an advantage in overall cost.
API Technology’s copper filled vias are available in diameters from 0.005” to 0.012”. They’re available on alumina, alumina nitride, and beryllium oxide substrates and include a thermal conductivity cooling path. They also provide electrical conductance to the back layer of the substrate. For more information on API’s advanced thin film capabilities, download the brochure.