Product/Service

Ceramic Material

Three grades of material from this product family, including the RT/duroid 6006 (er =6.15), RT/duroid 6002 (er =2.94) and 6010 (er =10.2, were developed to reduce the size of circuit boards
s of material from this product family, including the RT/duroid 6006 (er =6.15), RT/duroid 6002 (er =2.94) and 6010 (er =10.2, were developed to reduce the size of circuit boards. These products feature high dielectric constant thermal stability and a coefficient of thermal expansion matched to that of copper. The high dielectric constant of these materials yields small signal wavelengths allowing for small circuits. It can be used for applications in thermal changing environments (space) and multilayer constructions due to the reliability of plated through holes as well as in relatively high frequency applications because of its low dielectric loss.

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