AWR Announces AWR Design Forum And Call For Papers

AWR Corporation, the innovation leader in high-frequency EDA, announced recently the dates, Asia Pacific venues and call for papers of its July 2011 AWR Design Forum. The AWR Design Forum is an open event at which designers of microwave and RF circuit and systems such as MMIC, RF PCB and LTE communication systems can network and share useful information and resources pertinent to high-frequency design, discuss AWR products and technologies, and collaborate on industry issues and trends.

Location and Dates:

Seoul, Korea - July 15
Taipei, Taiwan - July 19
Tokyo, Japan - July 22

Call for Papers
The AWR Design Forum provides for the presentation of interesting and informative papers from colleagues working in the microwave & RF industry, research and educational institutions, as well as AWR's own simulation experts. Interested participants interested in presenting are requested to submit an abstracts to adf2011@awrcorp.com by 16 May 2011. Final presentations are due by 30 June 2011.

Suggested topics include but are not limited to RFIC and MMIC design, EM analysis of coplanar waveguide structures, LTE system simulation, microwave components, RF and microwave circuit boards, and RF SoCs, SiPs, and modules. All presentations will be made available for download from the AWR Web site after the event concludes. Additionally, prizes such as an Apple iPad2 will be awarded for best papers.

About AWR
AWR, the innovation leader in high-frequency EDA software, dramatically reduces development time and cost for products employed in wireless, high-speed wired, broadband, aerospace and defense, and electro-optical applications. For more information, visit http://www.awrcorp.com.

SOURCE: Cadence Design Systems, Inc.