By Anaren, Inc.
Over the last few years, the drive for miniaturization and integration has intensified the challenges concerning the trade off between repeatability, cost and time to market. The design must be robust enough to achieve good yields, but also have the lowest possible bill of material cost. The total cost not only depends on the number and types of parts and their associated cost, but also on the size of the PCB and enclosure.
At Anaren the focus is on developing products that address these trade-offs. Integrating 100% RF tested components increase yield and decreases size and time to market. The following application note demonstrates these objectives clearly as we present a small and simple balun solution optimized for use with Texas Instruments' CC2500 transceiver. The CC2500 is a true single-chip 2.4 GHz ISM and SRD compliant RF transceiver, designed for low-power wireless applications. The same balun solution can also be used with CC2510, CC2511 and CC2550 since these parts uses the same RF front end as CC2500. The balun solution presented in this application note uses only three components: a 1mm square Anaren multilayer balun, a DC blocking capacitor and an inductor for impedance matching. This results in a solution that minimizes space