Aluminum Nitride Substrates

Aluminum nitride substrates are ideal for high power amplifier multichip modules and heater applications, as well as imaging applications. This is because its material system is stable from cryogenic to high temperatures. Aluminum nitride also features high thermal conductivity with an excellent coefficient of thermal expansion (CTE) match to silicon.

Aluminum Nitride Substrates developed by AdTech Ceramics undergo a patented hot press technology process. The result is multilayer MCM substrates up to 4.5” square with hermetic via positional tolerances of +/- .15%. Additional mechanical features can be machined with diamond or ultrasonic tools. Photolithography and etching techniques can be used to apply a variety of surface metals, depending on application. Information on AdTech Ceramics’ design and capabilities can be accessed through the available guide listed above.