Ultra Small Form Factors Targeting Power-efficient Mobile Applications for Fast Time-to-market and High Reliability
ADLINK Technology Inc. recently introduces a new SMARC form factor computer-on-module running on Intel x86 processors. Using a single, dual, or quad core Intel Atom processor E3800 series system-on-chip from 1.3 to 2.2 GHz with soldered memory up to 4GB DDR3L at 1066/1333 MHz including ECC, the ADLINK LEC-BT product delivers top-of-the-line performance in efficient power use that targets a new generation of mobile applications with industrial-grade stability and reliability.
The SMARC (Smart Mobility ARChitecture) is a versatile ultra small footprint computer-on-module defined predominantly by ADLINK and Kontron and approved by the SGET (Standardization Group for Embedded Technology) Consortium. SMARC is an open and global standard for new generation embedded applications featuring low power, low cost and high performance, taking advantages from both legacy x86 and ARM-based designs. ADLINK previously released SMARC modules with ARM-based cores.
The ADLINK LEC-BT is a full size 82 mm x 80 mm module with onboard eMMC flash and ECC memory support. The low power design of SMARC (5 W to 10 W depending on number of cores and usage) allows for passive heat dissipation and enables smaller, quieter and cleaner systems. Although it is a small form factor, LEC-BT provides a variety of I/O interfaces for developing innovative new applications, including both legacy PC interfaces such as PCIe, SATA and HDMI, and modern ARM-like interfaces such as SPI, I2C, I2S. GbE is also provided for Ethernet connection, and other interfaces are included for a MIPI CSI compliant camera, USB2.0 and 3.0 (host and client), GPIO, and serial ports.
LEC-BT is designed for portable, or small stationary systems with application scenarios ranging from industrial automation, medical testing and measurement, to transportation and digital signage, especially for systems requiring high graphic performance in mobile applications. The LEC-BT modules can operate in an extremely wide temperature range from -40 to +85OC due to ADLINK’s proven Extreme Rugged technology.
ADLINK Technology today announced that its latest SMARC form factor module, the LEC-BT, is certified by Intel for Intel Gateway Solutions for the Internet of Things (IoT) using Windriver and McAfee software integration. Paired with ADLINK’s device-to-cloud platform SEMA Cloud (Smart Embedded Management Agent) that enables remote monitoring control and management, the LEC-BT is an ideal building block for developing IoT devices with a secure interconnection to the cloud.
ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and computer-on-modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc. and LiPPERT Embedded Computers GmbH, ADLINK also provides a wide range of rugged by design Extreme Rugged and Rugged product lines including single board computers, COMs and systems.
ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices.
ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified, is a Premier member of Intel Internet of Things Solutions Alliance, an Executive Member of PICMG, a Sponsor Member of the PXI Systems Alliance, an Executive Member of PC/104 Consortium, and a Strategic Member of the AXIe Consortium, a member of VMEbus International Trade Association (VITA).
SOURCE: ADLINK Technology Inc.