Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series

The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100^oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.