Additive Process Yields Consistent Substrate-Based Thin Film Circuits
Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures, recently announced it has developed new breakthroughs in processing substrate-based ultra-miniaturized circuits. The additive processes used are an alternative to traditional chemical etching, which causes circuit lines to slope, resulting in performance variations and yield issues.
Using these new additive fabrication techniques, Metrigraphics can now manufacture circuits in high volume with properties that include:
- Circuit lines and spaces as small as 10 microns
- Vias as small as 25 microns in diameter
- Plated through holes (PTHs) to ground with “metal-backed” ceramics
- Multilayer devices with up to six metal layers
Additive fabrication defines circuit lines by electroplating or sputtering metal traces onto either a rigid substrate in a single layer device or onto a polyimide layer in a multilayer device. The technique achieves extreme uniformity in geometries as well as the ability to deposit exactly the desired amount of metal in exactly the desired location.
The fabrication process is ideal for applications such as aerospace, defense, telecommunications, commercial printing and photonics. It works with a wide variety of substrates and conductive materials which can be laser cut to any shape and can include through-hole geometry. For more information, visit http://metrigraphicsllc.com/thin-film-circuits/
Metrigraphics is a process development specialist and manufacturer of ultra-miniature passive circuits and structures. They specialize in customized flexible circuits with features ranging in size from 2-10 microns and up to 6 metal layers with a variety of dielectrics. For more information, visit www.metrigraphicsllc.com.