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•Datasheet: MultiClad: Low-Loss Multilayerable Laminate

Arlon's MultiClad HF is a new halogen-free low-loss system that represents the next generation in low-loss multilayerable thermoset laminate and prepreg systems for microwave and high-frequency printed circuit boards. This new multi-purpose PWB material technology combines a ceramic-filled low-loss, high reliability thermoset resin system with bromine-free flame retardant system to create a material that is unmatched in terms of environmental standards, electrical performance, mechanical stability, thermal reliability and cost.

Key Product Features include:

• Low Loss for High Performance/High Frequency Applications
• Halogen-Free to Address Environmental Standards
• Thermally Robust for Lead-Free Solder Temperatures
• High Tg and Low Z-Direction Expansion for PTH Reliability
• Low TCEr for Phase Stability over Temperature
• Low Moisture Absorption
• Good Thermal Conductivity
• Competitive Dk and Df Values
• Stable Loss Values through Thermal Aging

MultiClad HF is designed for High-Speed Backplanes and Server boards, Power Amplifiers, Satellite receivers, LNB converters, as well as Semiconductor burn-in-boards and other high speed, high reliability applications.

Important Product Properties:

Click Here To Download:
•Datasheet: MultiClad: Low-Loss Multilayerable Laminate

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