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Introduction

RF and microwave systems have become increasingly sensitive to phase and dielectric constant variations in microwave laminates, due to the increased use of phase-fed networks and phase-steered antennas. As such, OEMs require a higher degree of electrical stability in order to achieve their system goals, which in turn places a higher demand on the laminate materials used in the design. Electrical phase stability, dielectric constant control, thinner cores, dimensional stability, and multilayer capability continue to drive the radar manifold and beam-steering markets toward greater innovations in microwave laminates. The growing trend of using thinner dielectrics and finer traces is being driven by higher frequencies (Ku, K, Ka, and millimeter wave bands) or even more stringent weight requirements placed on systems.

Materials that are dimensionally stable and temperature stable (electrically and mechanically), maintain excellent tolerances (thickness and dielectric constant), and have a low CTEz (coefficient of thermal expansion in the z direction) are required to satisfy the packaging requirements of multilayer military electronics that must endure wide temperature ranges (such as -55° to +150° C) and still maintain system capability and reliability. This is an extensive list of requirements to place on a material, but these requirements are necessary to maintain the degree of electrical performance expected from beamforming networks, complex radar manifolds, temperature-stable antennas, and multilayer boards that require a high degree of reliability.

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