Application Note

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•Application Note: Materials For Wireless Infrastructure

Despite the sustained downturn in the telecommunications industry, it remains one of the areas in which substantial growth remains "right around the corner" because, frankly, it is no longer economical to build out hard-wired infrastructures for new systems in countries without existing copper wire legacies. For those who are designing circuitry for telecom infrastructure it will be no surprise that what we call "soft substrates" -- copper clad products based on PTFE (polytetrafluoroethylene) and other low loss polymeric materials, are some of the backbones of the electronic modules comprising the infrastructure on which that soon-to-resume burgeoning industry is anchored.

The impact on materials requirements within the rapidly changing electronics industry is not relegated to the microwave and high frequency RF areas. The evolution of hand-held portable electronics (multifunctional 3G phones, PDA's, sub-notebook computers) and the convergence of cellular communications and the provision of internet service and access have had an impact of the type of materials required. High volume digital transmissions at data rates of 10 Gb/s require materials capable of handling high speed data as well as providing systems that go back and forth between fiber backhaul and opto-electronic in the local distribution network. High frequency signal integrity issues are endemic, and higher frequency allocations such as "smart cars" with frequency usage from 75 to 100 GHz also require materials with unique properties. Not only do materials have to operate at higher frequencies, but must withstand rigorous environmental testing in preparation for use in harsh environments such as jet engine controls and automotive under-the-hood applications.

Downloads:
•Application Note: Materials For Wireless Infrastructure