Datasheet
Datasheet: CuClad Bonding Films
Source: Arlon Materials for Electronics
CuClad 6250 and 6700 are low melting point bonding films that have been developed for lamination of stripline or other multilayer circuits fabricated from CuClad or other Arlon PTFE-based laminates. Dielectric constants of 6250 and 6700 Bonding Films fall in the midrange of CuClad and DiClad Microwave Printed Circuit Board Substrates product lines and ensure uniform reproducibility of electrical performance.
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