TI Introduces New Family Of RF Products For Broadband Wireless Applications
Chipsets at 2.5 GHz, 3.5 GHz, and 5.8 GHz are available for wireless broadband base stations and access points
Dallas -- Texas Instruments (TI) has expanded its portfolio of wireless signal-chain solutions for broadband wireless access by introducing three RF chipsets, the TRF11xx at 2.5 GHz, the TRF12xx at 3.5 GHz, and the TRF24xx at 5.8 GHz. The new chipsets are designed to support IEEE 802.16d/e standard RF front end for wireless base stations, access points, as well as equipment backhaul, point-to-point microwave, and public safety band applications. These new chipsets are capable of supporting both emerging WiMAX and WiBro applications based on the IEEE 802.16 standard, as well as the more traditional fixed wireless access.
"TI is working with equipment providers to build a solid foundation to deploy any type of broadband infrastructure demanded in the future," said David Briggs, TI's analog wireless infrastructure business manager. "We understand that as carriers look to incorporate the newest applications that they expect technologies, such as 802.16, to be readily available. TI is best equipped to ensure that equipment providers have the tools and flexibility they need to support emerging access technologies in the shortest timeframe."
2.5 GHz and 3.5 GHz flexible RF chipsets with power amplifiers
Both the TRF11xx chipset at 2.5 GHz and the TRF12xx chipset at 3.5 GHz consist of four chips, each with fully integrated super heterodyne receivers and transmitters. These RF chipsets are capable of supporting frequency division duplex (FDD), half frequency division duplex (HFDD), and time division duplex (TDD) modes with a real interface at low IF to the data conversion subsystem. The RF chipsets are compliant with today's demanding mask requirements, while the receivers feature excellent sensitivity and blocker suppression.
The TRF11xx and TRF12xx are also complemented by the optimized power amplifiers, TRF1123 and TRF1223. Supporting a range of frequencies between 2.1 and 2.7 GHz and 3.3 and 3.8 GHz, these power amplifiers provide an output third order intercept point (OIP3) of 45 dBm or better, enabling the support of complex OFDM (orthogonal frequency division multiplexing) signals. These power amplifiers can also be used as driver amplifiers in applications requiring larger output power.
5.8 GHz integrated chipset
TI's new TRF2432 and TRF2436 heterodyne transceiver chipset is the most integrated solution available with two chips. Consisting of an IF and RF transceiver, the chips supports the 4.9 to 5.9 GHz air interface frequency band. The chipset supports TDD mode with complex I/Q interface. This integrated chipset reduces space, making for easier design while saving bill of material (BOM) cost.
Complete system solution
TI offers a complete analog signal chain solution for wireless infrastructure OEMs with its ADS5500 analog-to digital-converter (ADC) and its DAC5687 digital-to-analog converter. Both converters can be supported by the digital up or down converter, GC5016, which is capable of handling wide bandwidths of up to 20 MHz. The CDC7005 can simultaneously clock each of these mixed signal chips with low jitter performance, maximizing the performance capabilities of particular ADCs.
TI also offers a next-generation programmable digital signal processor (DSP) capable of handling multiple air interface standards and a range of base station form factors on a single chip. The TMS320TCI6482 DSP at 1 GHz performs at nearly twice the clock speed of other available solutions, yet consumes only three watts of power, making it the industry's most power efficient DSP for wireless infrastructure systems.
Availability
All three TI chipsets -- the TRF11xx at 2.5 GHz, the TRF12xx at 3.5 GHz, and the TRF24xx at 5.8 GHz -- are now sampling.
Source: Texas Instruments