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"Since this family of M/A-COM driver amplifiers can be deployed as drivers in front of M/A-COM's point-to-point power amplifiers in a typical transmit chain, this is another demonstration of Tyco Electronics' commitment to complete P2P radio communications technology," said Jack Redus, product manager, Tyco Electronics. "The large frequency range supported by these amplifiers, as well as their typical gain flatness across individual P2P bands being +/- 0.5 dB, makes these amplifiers ideal components for end-to-end P2P communications."
All die are fabricated using M/A-COM's MSAG (Multi-function Self-Aligned Gate) process, which features a rugged polyimide coating and no air bridges. This coating produces a rugged chip for high assembly yields. The Mean Time to Failure (MTTF) is one million hours at 170º C junction temperature and the package option is a 16-lead, 4mm PQFN package, which is suitable for standard surface mount assembly processes. Each amplifier part is available in bare die and plastic packaged options. M/A-COM's family of power amplifiers is RoHS compliant and compatible with a 260º C reflow temperature.
SOURCE: Cobham Sensor Systems



