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Microsemi Announces DSCC Qualification On Diode Arrays For Defense And Aerospace Applications

January 12, 2009

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Microsemi Corporation, a leading manufacturer of high performance analog/mixed signal integrated circuits and high reliability semiconductors, announced recently that DSCC qualification has been granted on a family of twelve high conductance ultrafast switching diode array products.

Available for both through-hole and surface mount applications, these arrays are manufactured in several standard hermetic package configurations. Each part type is constructed utilizing multiple 1N4148 ultra high speed switching diode chips manufactured in Microsemi's JANS wafer fab. This rugged construction is particularly well suited for defense and aerospace applications which demand high reliability under severe environmental conditions.

Features include:

  • Low Capacitance less than 4 pF
  • Isolated Diode Junction Construction to eliminate cross talk
  • Fast switching speeds less than 20ns (10ns on 1N6100, 1N6101,1N6510, 1N6511)
  • Low leakage; Ir less than 100nA at 40V

"Our customers have expressed strong demand for these arrays, so we are pleased to be able to add them to our already extensive QPL listing," said Kare Karlsen, Microsemi Executive Vice President of Military and Aerospace Products, adding "Our Lawrence, Massachusetts facility is now in full production on these devices."

About Microsemi
Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.

Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at http://www.microsemi.com.

SOURCE: Microsemi Corporation

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