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By Cobham Sensor Systems

Abstract
A test methodology will be presented that combines the advantages of on-wafer RF probing with a TRL calibration to create a completely de-embeddable, novel "test fixture" capable of electrically characterizing most any style package or device. This scheme has been used to characterize many of the currently available microwave packages in order to identify appropriate packages for M/A-COM's MMIC amplifier products that cover frequencies up to 12 GHz. In addition, the technique has been employed to characterize injection-molded plastic packages and to evaluate non-probeable MMICs.

Introduction
Most package vendors have very little microwave design and characterization capability. Their limited characterization efforts typically involve the use of poor fixturing, which obscures the true frequency response of the package. Companies specializing in fixturing, while investing considerable mechanical engineering effort, expend far less on electrical considerations, often producing fixtures inadequate for use at microwave frequencies. Consequently, there is very little microwave performance data available from package vendors.

Therefore, to evaluate and identify candidate packages for each of the amplifiers in M/A-COM's MMIC amplifier product line, specific fixturing had to be developed for each package style considered. A novel fixturing approach was designed and implemented, which not only eliminates the need for expensive, package specific fixtures, but also overcomes the frequency limitations of traditional connectorized, plunger-style fixtures. Additionally, a rigorous calibration method was developed that allows complete fixture de-embedding.

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