Arlon Launches RF And Microwave Laminate With High Thermal Conductivity

January 11, 2008

Bear, DE -- Arlon Inc. announced the availability of the TC600 Microwave Laminate, the first product in its "TC Family of Products". TC600, with a 6.15 dielectric constant, is designed to provide enhanced heat-transfer through "Best-In-Class" thermal conductivity, while reducing dielectric loss, insertion loss, and dielectric constant variation with temperature. The increased thermal conductivity of TC600 provides higher power handling, reduces power amplifier junction temperatures and reduces solder joint fatigue. This unique material property can be used to compliment or reduce the system costs of existing thermal management solutions.

TC600 has "Best-In-Class" Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes. Dielectric constant stability is also critical to phase sensitive devices such as power divider circuitry or network transformers utilized for impedance matching networks utilized in power amplifier transformer circuitry. The low coefficient of thermal expansion properties also provide a higher level of component attachment and plated thru hole reliability for improved device reliability and lower warranty costs.

SOURCE: Arlon Materials for Electronics