ADEPT-SiP Project To Develop Design Methodology For SiP Electronics

Cambridge, UK -- Flomerics has introduced a new System-in-Package (SiP) paradigm in electronics product implementation that allows the mixing of optimum active and passive device technologies in bare die format within a single package outline. The SiP module provides short time-to-market functionality matched to a wide range of low, medium, and high volume electronics product applications. The addition of embedded passive component technology within such SiP modules also promises performance, size, weight, and cost benefits.

The SiP approach allows board level functionality to be realized at the package level for smaller, lighter, and higher functionality products. However, a major obstacle to the introduction of this new technology is the lack of a design methodology supported by simulation tools, accurate component and technology models. The ADEPT-SiP project, that is funded through the DTI Technology Programme under the Design, Simulation and Modelling Technology priority area, is directed at eliminating this obstacle.

The 30-month ADEPT-SiP project started in May 2006 and will develop and demonstrate a right-first-time design and supply chain management methodology for System-in-Package Electronics Product Functions. It will address schematic capture, partitioning and active device, substrate and package design to meet specific performance, cost, size and weight targets. Other design stages will include thermal and EMC design, and design-for-manufacture, for test, reliability and for environmental impact. Novel, high density embedded passive substrate technologies will be designed and simulated, process characterization undertaken and component models developed for the full range of passive components and interconnection and assembly structures. The core design, simulation and modelling activities will then be proven in SiP technology demonstrators.

The ADEPT-SiP project partners include Filtronic Broadband and Zarlink Semiconductors' Advanced Packaging Division based in Caldicot as SiP product end-users, Leeds University as modelling provider, Zuken, QuantumCAD and Flomerics as design providers, and Wurth Elektronik and TWI as technology providers.

SOURCE: Flomerics, Inc.